| 发明名称 |
NOVEL POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND CIRCUIT BOARD |
| 摘要 |
The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film. |
| 申请公布号 |
US2014011905(A1) |
申请公布日期 |
2014.01.09 |
| 申请号 |
US201214006062 |
申请日期 |
2012.03.19 |
| 申请人 |
KYUNG YOU-JIN;KIM HEE-JUNG;LEE KWANG-JOO;KIM JUNG-HAK;LG CHEM, LTD. |
发明人 |
KYUNG YOU-JIN;KIM HEE-JUNG;LEE KWANG-JOO;KIM JUNG-HAK |
| 分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
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