Soldering nozzle for soldering device for soldering components having a number of solder joints to be soldered, comprises nozzle chamber and a device with which solder flow in flow area and contour of exiting soldering wave is influenced

摘要

Soldering nozzle (10, 10') for a soldering device for soldering components, preferably components having a number of solder joints to be soldered, comprises a nozzle chamber (18, 18'), through which the solder (19, 19') flows in the direction of a solder outlet opening (20, 20') of the soldering nozzle, and from which the solder exits as a solder wave (22, 22'); and a device arranged in a flow area of the nozzle chamber, with which the solder flow in the flow area and the contour of the exiting soldering wave is influenced.