| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology which enables division of a wafer to be unfailingly performed in a processing method of the wafer where multiple devices, each of which has multiple spherical electrodes protruded from a surface, are formed on a surface.SOLUTION: A processing method of a wafer includes: a bit cutting step where an upper end of each electrode of a wafer, which is held on a holding surface of a chuck table exposing the surface side on which the electrodes are disposed, is cut by a bit rotated around a rotation axis perpendicular to the holding surface to form a flat part on the upper end of each electrode; a frame unit formation step where the flat parts of a surface of the wafer, in which the flat part is formed at each electrode, are placed in contact with an adhesive tape attached to an annular frame and having expandability and are bonded to form a frame unit; a modified layer formation step where a modified layer is formed in the wafer; and an extension step where the wafer is fractured along the modified layer. |
