| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having no level difference between a pattern circuit part and a resist layer formed on a base material, causing no blistering and peeling of a plating resist in a metal plating process, and having excellent connection reliability when electronic components such as a light emitting element are mounted to the printed wiring board.SOLUTION: The exposed surface of the pattern circuit part and the surface of the resist layer which are formed on the base material are formed into an almost uniform flat surface in this printed wiring board, and the resist layer is formed from a hardened material of a thermosetting resin composition containing a thermosetting component, a thixotropic agent, and an inorganic coloring pigment. Preferably, the pattern circuit part contains a pattern circuit part having the exposed surface and a pattern circuit part covered with the resist layer, and the pattern circuit part having the exposed surface is at least either one of a terminal part, a component mounting pad part, and a circuit part. In a preferable configuration, the composition additionally contains an adhesion imparting agent, and contains an inorganic thixotropic agent and an organic thixotropic agent as the thixotropic agent. |
