发明名称 III-V COMPOUND SEMICONDUCTOR DEVICE HAVING METAL CONTACTS AND METHOD OF MAKING THE SAME
摘要 semiconductor device comprises a semiconductor substrate; a channel layer of at least a first III-V semiconductor compound above the semiconductor substrate; a gate stack structure above a first portion of the channel layer; a source region and a drain region comprising at least a second III-V semiconductor compound above a second portion of the channel layer; and a first metal contact structure above the S/D regions comprising a first metallic contact layer contacting the S/D regions. The first metallic contact layer comprises at least one metal-III-V semiconductor compound.
申请公布号 US2014008699(A1) 申请公布日期 2014.01.09
申请号 US201213542860 申请日期 2012.07.06
申请人 OXLAND RICHARD KENNETH;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 OXLAND RICHARD KENNETH
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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