发明名称 |
WAFER CLEANING SYSTEM AND METHOD USING ELECTROLYTIC GAS FOR BACK-END PURGE |
摘要 |
A wafer cleaning system includes a platform, a plurality of wafer holding units over the platform, a front-end rinse nozzle, and a back-end purge unit. The plurality of wafer holding units is set to define a reference plane of wafer holding. The front-end rinse nozzle is above the reference plane and configured to dispense a first rinse fluid toward the reference plane. The back-end purge unit is below the reference plane and configured to dispense an electrolytic gas |
申请公布号 |
US2014007905(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
US201213544637 |
申请日期 |
2012.07.09 |
申请人 |
SUN CHUNG-REN;KO HSIANG HSIANG;LIAO MIAO-CHENG;TSENG WEI-YANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SUN CHUNG-REN;KO HSIANG HSIANG;LIAO MIAO-CHENG;TSENG WEI-YANG |
分类号 |
B08B3/00 |
主分类号 |
B08B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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