发明名称 |
THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE |
摘要 |
Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts. |
申请公布号 |
US2014008777(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
US201213541561 |
申请日期 |
2012.07.03 |
申请人 |
LOH ALBERT;THEN EDWARD;PEDRON, JR. SERAFIN;SIRINORAKUL SARAVUTH;UTAC DONGGUAN LTD |
发明人 |
LOH ALBERT;THEN EDWARD;PEDRON, JR. SERAFIN;SIRINORAKUL SARAVUTH |
分类号 |
H01L21/60;H01L23/495 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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