| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of reducing the cost of manufacture and improving the product quality.SOLUTION: A semiconductor laser 4 is arranged on an upper surface of a stem 1. Leads 5 and 6 penetrate through the stem 1, and protrude from the upper surface of the stem 1. The leads 5 and 6 do not protrude from a lower surface of the stem 1. The protruded parts of the leads 5 and 6 are electrically connected to the semiconductor laser 4 by wires 8 and 10. On the upper surface of the stem 1, a cap 12 with a lens 11 covers the semiconductor laser 4, the protruded parts of the leads 5 and 6, and the wires 8 and 10. Solder balls 13 and 14 are arranged on the lower surface of the stem 1, and electrically connected to the leads 5 and 6. |
