| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition that provides a cured product having a low dielectric constant and a dielectric tangent, that provides a cured product in which formability at a normal press molding temperature is excellent and that has excellent heat resistance and adhesiveness, and further that can provide a laminate sheet that satisfies requirement of multi-layer and high frequency.SOLUTION: A curable resin composition includes: a polyphenylene ether (A); and an inorganic particle (B), wherein an average phenolic hydroxyl group number per one molecule of the polyphenylene ether (A) is at least 0.3, a content of silica (B) is at least 25 mass% and at most 80 mass% in the total mass of the curable resin composition, a resin flow amount of the curable resin composition when being cured is at least 0.3% and at most 15%, and the curable resin composition provides a cured product in which a dielectric tangent at 1GHz is at most 0.005 and a glass transformation temperature is at least 170°C. |
