| 摘要 |
PROBLEM TO BE SOLVED: To form a test device for electronic component elements molded on a substrate so as to perform a number of test steps during manufacturing of the component elements on the substrate without damaging the substrate, component elements, and/or connections between the substrate and component elements.SOLUTION: A test device tests electronic component elements molded on a substrate (9) using a test pin (12) that can be mounted on the contact point face of the substrate (9). A frame-like support structure (14) for supporting the substrate (9) is provided such that an individual component element (10) is within a free space of the support structure (14). |
