发明名称 ALUMINUM-NITRIDE BUFFER AND ACTIVE LAYERS BY PHYSICAL VAPOR DEPOSITION
摘要 <p>Embodiments of the invention described herein generally relate to an apparatus and methods for forming high quality buffer layers and Group III-V layers that are used to form a useful semiconductor device, such as a power device, light emitting diode (LED), laser diode (LD) or other useful device. Embodiments of the invention may also include an apparatus and methods for forming high quality buffer layers, Group III-V layers and electrode layers that are used to form a useful semiconductor device. In some embodiments, an apparatus and method includes the use of one or more cluster tools having one or more physical vapor deposition (PVD) chambers that are adapted to deposit a high quality aluminum nitride (AlN) buffer layer that has a high crystalline orientation on a surface of a plurality of substrates at the same time.</p>
申请公布号 WO2014008162(A1) 申请公布日期 2014.01.09
申请号 WO2013US48879 申请日期 2013.07.01
申请人 APPLIED MATERIALS, INC.;ZHU, MINGWEI;PATIBANDLA, NAG B.;WANG, RONGJUN;AGRAWAL, VIVEK;SUBRAMANI, ANANTHA;DIEHL, DANIEL L.;TANG, XIANMIN 发明人 ZHU, MINGWEI;PATIBANDLA, NAG B.;WANG, RONGJUN;AGRAWAL, VIVEK;SUBRAMANI, ANANTHA;DIEHL, DANIEL L.;TANG, XIANMIN
分类号 C23C14/34;C23C14/06;C23C14/54 主分类号 C23C14/34
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