| 发明名称 |
BONDING COMPOSITION AND BOARD |
| 摘要 |
The purpose of the present invention is to provide a bonding composition having high adhesion, from which formaldehyde is hardly released. The present invention relates to a bonding composition cured through heating and pressing. The bonding composition contains a polyvalent carboxylic acid. |
| 申请公布号 |
US2014011042(A1) |
申请公布日期 |
2014.01.09 |
| 申请号 |
US201214006011 |
申请日期 |
2012.03.23 |
| 申请人 |
SUGAWARA RYO;UMEMURA KENJI;PANASONIC CORPORATION |
发明人 |
SUGAWARA RYO;UMEMURA KENJI |
| 分类号 |
C09J11/06 |
主分类号 |
C09J11/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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