发明名称 POLYIMIDE FILM FOR ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the pattern accuracy by providing a double polyimide film composed of a nonphotosensitive polyimide film on a base and photosensitive polyimide film thereon. SOLUTION: An Al base layer 2 is formed on a part of a substrate 1 by sputtering with a mask. The substrate 1 is mounted on a spin coater to coat a nonphotosensitive polyimide film at a specified rotation speed for a specified time, heated on a hot plate and cooled down to form a nonphotosensitive polyimide film 3. The substrate 1 is again mounted on the spin coater to coat a photosensitive polyimide film at a specified rotation speed for a specified time, heated on the hot plate and cooled down to form a photosensitive polyimide film 4, thus forming a double layer. This suppresses the cracking to improve the pattern accuracy.
申请公布号 JPH10144674(A) 申请公布日期 1998.05.29
申请号 JP19960293529 申请日期 1996.11.06
申请人 FUJI ELECTRIC CO LTD 发明人 KATO TSUTOMU;SOMA YASUHISA
分类号 B32B27/34;C08G73/10;C09D179/08;H01L21/027;H01L21/312;(IPC1-7):H01L21/312 主分类号 B32B27/34
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