发明名称 |
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING |
摘要 |
A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved. |
申请公布号 |
US2014008814(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
US201313895704 |
申请日期 |
2013.05.16 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHEN TIEN-SZU;LEE CHUN-CHE;WANG SHENG-MING |
分类号 |
H01L23/48;H01L21/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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