发明名称 |
SUBSTRATE OF SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE USING THE SAME |
摘要 |
A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier. |
申请公布号 |
US2014008794(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
US201313900612 |
申请日期 |
2013.05.23 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
PARK GI-JUN;KIM WON-KEUN;LEE TEAK-HOON;JEON CHANG-SEONG;JEE YOUNG-KUN |
分类号 |
H01L23/498;H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|