| 摘要 |
LED dies are mounted a single submount tile (or wafer). The LED dies have a light emitting top surface. A uniformly thick layer of UV sensitive silicone infused with phosphor is then deposited over the tile, including over the tops and sides of the LED dies. Only the silicone/phosphor over the top and sides of the LED dies is desired, so the silicone/phosphor directly on the tile needs to be removed. The silicone/phosphor layer is then masked to expose the areas that are to remain to UV light, which creates a cross-linked silicone. The unexposed silicone/phosphor layer is then dissolved with a solvent and removed from the tile surface. The silicone/phosphor layer may be defined to expose a wire bond electrode on the LED dies. The tile is ultimately singulated to produce individual phosphor-converted LEDs. |
