| 摘要 |
A deposition apparatus comprises a vacuum chamber; a substrate holder; a target; and an angle correcting plate provided so as to cover an upper space of the principal surface of the substrate, and provided outside a spatial region encompassed by line segments connecting a periphery of the principal surface of the target and a periphery of the principal surface of the substrate, wherein when an arbitrary point on the principal surface of the substrate is denoted by B and at least a center point on the principal surface of the target is denoted by C, a part of the principal surface of the angle correcting plate exists on each line which forms 45° from the respective point B with respect to each line which connects the respective point B and the point C, and another part of the principal surface of the angle correcting plate extends to a side opposite to the target. |
