BASE SHEET FOR ELECTRONIC COMPONENT PACKAGING, MULTILAYER SHEET FOR ELECTRONIC COMPONENT PACKAGING, CARRIER TAPE FOR ELECTRONIC COMPONENT PACKAGING, AND ELECTRONIC COMPONENT CARRIER

摘要

Provided are: a base sheet for electronic component packaging, which is reduced in the effect of punching conditions on burr formation; a multilayer sheet for electronic component packaging; a carrier tape for electronic component packaging, and an electronic component carrier. This base sheet for electronic component packaging is configured of a resin composition that contains a polystyrene resin (A) and an impact-resistant polystyrene resin (B), and is characterized in that the content of the polystyrene resin (A) is from 1% by weight to 50% by weight (inclusive) and the content of the impact-resistant polystyrene resin (B) is from 50% by weight to 99% by weight (inclusive).