发明名称 |
HEAT-CONDUCTIVE ADHESIVE SHEET |
摘要 |
<p>The purpose of the present invention is to provide a heat-conducive adhesive sheet which comprises a heat-conductive filler and an acrylic adhesive component and has high initial adhesive power and excellent heat resistance. The acrylic adhesive component is a cured product of a composition which comprises a (meth)acrylic oligomer and a (meth)acrylate monomer having a hydroxyl group and contains no carboxyl group. The heat-conducive adhesive sheet has high initial adhesive power and can maintain the adhesive power thereof at a high level for a long period.</p> |
申请公布号 |
WO2014007208(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
WO2013JP68027 |
申请日期 |
2013.07.01 |
申请人 |
POLYMATECH JAPAN CO.,LTD. |
发明人 |
WATANABE, YASUYOSHI;KUDOH, HIROKI;KIKUCHI, KOZUE |
分类号 |
C09J7/00;C09J11/00;C09J133/14 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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