发明名称 HEAT-CONDUCTIVE ADHESIVE SHEET
摘要 <p>The purpose of the present invention is to provide a heat-conducive adhesive sheet which comprises a heat-conductive filler and an acrylic adhesive component and has high initial adhesive power and excellent heat resistance. The acrylic adhesive component is a cured product of a composition which comprises a (meth)acrylic oligomer and a (meth)acrylate monomer having a hydroxyl group and contains no carboxyl group. The heat-conducive adhesive sheet has high initial adhesive power and can maintain the adhesive power thereof at a high level for a long period.</p>
申请公布号 WO2014007208(A1) 申请公布日期 2014.01.09
申请号 WO2013JP68027 申请日期 2013.07.01
申请人 POLYMATECH JAPAN CO.,LTD. 发明人 WATANABE, YASUYOSHI;KUDOH, HIROKI;KIKUCHI, KOZUE
分类号 C09J7/00;C09J11/00;C09J133/14 主分类号 C09J7/00
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