| 摘要 |
<p>According to the present invention, a superimposed module package includes a printed circuit board, a first module electrically connected onto the printed circuit board, and a second module electrically connected onto the printed circuit board and the first module and overlapped with the printed circuit board and the first module. According to the present invention, the superimposed module package is used in various categories for product lineup by applying various combinations such as a power module, a control module, a light emitting module, a storage module, etc. to each module.</p> |
