发明名称 THERMOELECTRIC COOLING MODULE AND MANUFACTURING METHOD THEREOF
摘要 The present invention includes a first substrate, a second substrate and a plurality of thermoelectric elements which are formed between the first and second substrates. The first and second substrates include metal electrodes and face each other. The efficiency of a thermoelectric cooling module is improved by reducing contact resistance by including the first and second substrates which are composed of aluminum layers and Al2O3 layers which are formed on a part of the surfaces of the aluminum layer facing each other. The costs of the thermoelectric cooling module are reduced.
申请公布号 KR20140002158(A) 申请公布日期 2014.01.08
申请号 KR20120069866 申请日期 2012.06.28
申请人 LG INNOTEK CO., LTD. 发明人 LEE, JONG MIN
分类号 H01L35/02;H01L35/34 主分类号 H01L35/02
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