| 摘要 |
A high-performance low-cost functional module package handles microwaves or millimeter waves. The package has multilayered dielectric substrates, signal through holes (25, 28) connected to signal conductors that are formed on one of the dielectric substrates, and ground through holes (24, 26, 27, 29) connected to ground conductors that are formed on another of the dielectric substrates. The through holes are formed on side faces of the dielectric substrates and serve as terminals. Each pair of the ground through holes (24 and 26, or 27 and 29) is arranged on opposite sides of a corresponding one (25 or 28) of the signal through holes. The terminals are positioned between parts of the package to be connected to an external circuit board and the signal and ground conductors.
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