The present invention relates to a light emitting diode chip. According to the present invention, a light emitting diode chip including a substrate having a thickness exceeding 120 µm and a light emitting diode disposed on one surface of the substrate is provided.
申请公布号
EP2682992(A1)
申请公布日期
2014.01.08
申请号
EP20120752035
申请日期
2012.02.24
申请人
SEOUL OPTO DEVICE CO., LTD.
发明人
LEE, KYU HO;SUH, DAE WOONG;SEO, WON CHEOL;KIM, CHANG HOON;LEE, SUNG HYUN;IN, CHI HYUN
