ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

摘要

A producing method of an encapsulating layer covered semiconductor element comprises; a process of preparing a supporting sheet having a hardened supporting plate; a semiconductor element arrangement process of arranging a semiconductor element on one side of a thickness direction of the supporting sheet; an arrangement process of arranging an encapsulating layer made of an encapsulating resin composite having a hardened resin on one side of the thickness direction of the supporting sheet to cover the semiconductor element after the semiconductor element arrangement process; an encapsulating process of sealing the semiconductor element with a flexible encapsulating layer by hardening the encapsulating layer; a cutting process of obtaining an encapsulating layer covered semiconductor element having the encapsulating layer for covering the semiconductor element by cutting the flexible encapsulating layer in response to the semiconductor element; and a semiconductor element separation process of separating the encapsulating layer covered semiconductor element from the supporting sheet. [Reference numerals] (AA) Upper side; (BB) Lower side; (CC) Thickness direction; (DD) Left and right direction