| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device in which the peeling of a semiconductor integrated circuit chip can be prevented, and moisture resistance can be made proper. SOLUTION: This method is provided for manufacturing a plastic ball grid array 12, having a structure in which a semiconductor integrated circuit chip 7 is mounted on a wiring substrate 3 with resin components as main constituent materials, a solder ball terminal 11 to be connected with a mother board is provided, and the surrounding part of the semiconductor integrated circuit chip 7 is resin encapsulated 10. Also, this method includes a process for removing moisture attached to the surface of a wiring board 6 immediately prior to before a process for fixing the semiconductor integrated circuit chip 7 to the wiring board 6 with an adhesive 8. |
