发明名称 LAMINATED METALLIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To attain further improvement of the function of an insulating layer avoiding cost increase as much as possible in relation to an adhesive layer as a fundamental component of a laminated metallic substrate. SOLUTION: In a laminated metallic substrate composed of a metallic substrate 1 on one side and a high conductive metallic foil 3 on the other side through the intermediary of an adhesive layer 2, heat resistant thermosetting resin layers 22 are provided on both sides of a non-combustible or frame retardant organic insulating paper 21 as for the adhesive layer 2. Besides, heat resistant thermosetting resin layers 22 can be blended with non-conductive grains or fibers. Furthermore, as for the adhesive layer 2, the material arranged with the heat resistant thermosetting resin layer blended with nonconductive grains or fiber is provided on both sides of an inorganic fiber paper made insulating layer.
申请公布号 JPH11204903(A) 申请公布日期 1999.07.30
申请号 JP19980006045 申请日期 1998.01.14
申请人 KOBE STEEL LTD 发明人 IBATA HARUHIRO;KIHARA ATSUSHI;NAKAMURA HIDEKI
分类号 B32B7/12;B32B15/08;H05K1/05;H05K3/46;(IPC1-7):H05K1/05 主分类号 B32B7/12
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