| 摘要 |
The present invention relates to a conductive via paste composition for interlayer connection of non-sintering ceramic hybrid substrates. The conductive via paste composition contains a conducive material mixture containing one or more conductive materials; and a thermosetting resin mixture containing thermosetting resin and thermosetting resin curing agent. The curing agent is characterized to maintaining curing temperature of the thermosetting resin over sintering temperature of the conductive material mixture. |
