| 摘要 |
PURPOSE: A method for manufacturing electrode wiring on a substrate and the substrate using the same are provided to perform the thermal treatment of an upper surface of the substrate, thereby improving adhesion between a metal layer and the substrate. CONSTITUTION: Copper and chrome are deposited on a substrate (1) to form a seed layer (2). The mixing ratio of the chrome is more than that of the copper in a part that the copper and the chrome are in contact with the surface of the substrate. The mixing ratio of the copper gradually increases toward the upper part of the seed layer. The composition ratio of the copper and the chrome gradually changes along the thickness direction of the seed layer. |
