| 摘要 |
<p>An image pickup apparatus 10, which is a semiconductor device, includes a semiconductor chip 20 including a light receiving section 21, a frame-like spacer 30 arranged on the semiconductor chip 20 to surround the light receiving section 21, a transparent flat plate section 40 arranged on the semiconductor chip 20 via the spacer 30 and having a plan view dimension larger than a plan view dimension of the spacer 30 and smaller than a plan view dimension of the semiconductor chip 20, and a reinforcing member 50 for filling a gap between the semiconductor chip 20 and the transparent flat plate section 40 on the outer side of the spacer 30 and having a plan view dimension larger than the plan view dimension of the transparent flat plate section 40 and smaller than the plan view dimension of the semiconductor chip 20.</p> |
