| 摘要 |
PROBLEM TO BE SOLVED: To secure insulation performance of a mold wiring board and at the same time improve reliability, due to improvement in strength with respect to external force or the like. SOLUTION: A resin formation wiring board is provided with a plurality of rows of metal frames 1 as a conductive part, and a first resin part 10 and a second resin part 20 for covering the periphery of the metal frame, so that the metal frame is sandwiched. An insulation rib 11 or the like is provided at primary forming between metal frames, and second formation is made to adhere to the rib or the like, thus ensuring insulation distance. Also, adhesion property may be improved by subjecting it to fine irregularity machining to the adhesion surface with a resin part, due to secondary formation during first forming. As a result, interface peel off due to bending stress is prevented, and strength and insulation performance are improved. |
