| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a semiconductor, wherein a gap interval immediately before wafer working is accurately measured for each wafer, for improved gap accuracy and maintaining constant wafer work quality. SOLUTION: This semiconductor manufacturing apparatus comprises, in a process chamber 1, an upper part electrode 15, an upper-side electrode member 16 comprising the upper part electrode 15, a lower part electrode 11, a lower side electrode member 17 comprising the lower part electrode 11, a lift pin 10 provided at the lower side electrode member 17, a contact point 12 provided at the lift pin 10, a pulse motor 13 for driving the lift pin 10, a pulse motor 13 for driving the lift pin 10, and a drive gear 14. An interval (gap value) between the upper part electrode 15 and the lower part electrode 17 is measured from rising/falling actions of the lift pin 10, which is compared to an originally set gap value. When the gap value agrees with the set value, an etching process is started with a wafer surface. When there is no agreement, the drive gear 14 is driven, based on the signal corrected according to the difference between the gap value and set value, subjecting it to correction processing. Thus, the work quality of a wafer is kept at a constant level. |
