发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device wherein a substrate is processed evenly with a processor liquid adjusted to a specified temperature while the footprint is reduced and the cost is decreased. SOLUTION: A developing device comprises a device main body part 100 and a separate cabinet 200. The device main body part 100 comprises a process part 1 and a relay box 10. The separate cabinet 200 comprises a temperature adjuster 20, temperature-adjustment cluster box 30, and developer liquid buffer tank 70. The temperature-adjustment cluster box 30 of the separate cabinet 200 and the relay box 10 of the device main body part 100 are connected together with a double piping 63. The double piping 63 has a double structure comprising an inside developer liquid piping 43 and outside constant-temperature water piping 53. The relay box 10 is connected to a developer liquid discharge nozzle 4 of the process part l through a double piping 60.
申请公布号 JP2000182926(A) 申请公布日期 2000.06.30
申请号 JP19980354213 申请日期 1998.12.14
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KOUGAKI KOUICHI;CHIKAMORI RYUICHI;MAEDA MASASHI
分类号 H01L21/027;G03F7/30;(IPC1-7):H01L21/027 主分类号 H01L21/027
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