发明名称 |
SUBSTRATE PROCESSING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device wherein a substrate is processed evenly with a processor liquid adjusted to a specified temperature while the footprint is reduced and the cost is decreased. SOLUTION: A developing device comprises a device main body part 100 and a separate cabinet 200. The device main body part 100 comprises a process part 1 and a relay box 10. The separate cabinet 200 comprises a temperature adjuster 20, temperature-adjustment cluster box 30, and developer liquid buffer tank 70. The temperature-adjustment cluster box 30 of the separate cabinet 200 and the relay box 10 of the device main body part 100 are connected together with a double piping 63. The double piping 63 has a double structure comprising an inside developer liquid piping 43 and outside constant-temperature water piping 53. The relay box 10 is connected to a developer liquid discharge nozzle 4 of the process part l through a double piping 60. |
申请公布号 |
JP2000182926(A) |
申请公布日期 |
2000.06.30 |
申请号 |
JP19980354213 |
申请日期 |
1998.12.14 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
KOUGAKI KOUICHI;CHIKAMORI RYUICHI;MAEDA MASASHI |
分类号 |
H01L21/027;G03F7/30;(IPC1-7):H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|