WIRING PATTERN FORMING METHOD BY LIFT-OFF METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring pattern forming method that does not require complex steps as compared with the conventional lift-off method, can be applied to any of positive type and negative type resists and uses a resist pattern having a mushroom-shape cross section. SOLUTION: The top of a substrate 31 is coated with a resist 32, and the resist 32 is exposed through a desired pattern and developed. The resultant resist pattern 34 is heat-treated at a temperature at which the resist is deformed to form a resist pattern 35 having a mushroom cross section. The objective fine wiring pattern is formed using the resist pattern 35 as a mask.