| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board having fine and highly reliable via connection and highly reliable through-hole connection and using a simple process, and to provide a manufacture method for inexpensively obtaining the multilayer wiring board that can realize wiring of high density. SOLUTION: In a multilayer wiring board 1', wiring pattern layers 2a-2d are connected by a through-hole connection part 5a and a non-through hole connection part 5b, which are formed by conductive bumps 4, into which interlayer insulating layers 3a-3c are force-fitted/inserted. At least one of junction parts between the wiring patterns 2a-2d is opened smaller than the diameters of the conductive bumps 4, and the tip parts of the conductive bumps 4 are force-fitted to the small diameter openings. |
