PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME

摘要

The present invention relates to an apparatus including a first package element and a second package element. The first package element includes first connectors formed in the upper surface of the first package element and second connectors formed in the upper surface. The second package element is formed on the first connector and bonded to the first connectors. The second connectors are not connected to the second package element. A solder resist is formed on the upper surface of the first package element. A trench is arranged in the solder resist. A part of the trench separates the second connectors from the first connectors.