| 摘要 |
<p>The present invention relates to an epoxy resin composition comprising the following [A], [A'], [B], and [C]: [A] a bisphenol-type epoxy resin having a glass transition temperature or melting point of 50°C or higher; [A'] an epoxy resin which is in a liquid state at 25°C; [B] an epoxy resin curing agent; and [C] at least one block copolymer selected from the group consisting of S-B-M, B-M, and M-B-M, wherein the blocks are linked to each other by a covalent bond or by an intermediate molecule bound to one of the blocks via one covalent bond formation and to the other block via another covalent bond formation; the block M is a methyl methacrylate homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate; the block B is incompatible with the block M and has a glass transition temperature of 20°C or lower; and the block S is incompatible with the blocks B and M and has a glass transition temperature higher than that of the block B, a prepreg obtained by impregnating a fiber base with the epoxy resin composition, and a fiber-reinforced composite material obtained by curing the prepreg.</p> |
