发明名称 |
SPUTTERING EQUIPMENT, SPUTTERING METHOD AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE |
摘要 |
<p>A sputtering apparatus includes a substrate holder (22) which holds a substrate (21) to be rotatable in the plane direction of the processing surface of the substrate (21), a substrate-side magnet (30) which is arranged around the substrate (21) and forms a magnetic field on the processing surface of the substrate (21), a cathode (41) which is arranged diagonally above the substrate (21) and receives discharge power, a position detection unit (23) which detects the rotational position of the substrate (21), and a controller (5) which controls the discharge power in accordance with the rotational position detected by the position detection unit (23).</p> |
申请公布号 |
EP2390380(A4) |
申请公布日期 |
2014.01.08 |
申请号 |
EP20090834517 |
申请日期 |
2009.12.25 |
申请人 |
CANON ANELVA CORPORATION |
发明人 |
KITADA, TORU;WATANABE, NAOKI;NAGAI, MOTONOBU |
分类号 |
C23C14/34;C23C14/54;H01F41/18;H01J37/34;H01L43/08;H01L43/12 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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