发明名称 FOAM LAMINATED BODY FOR ELECTRICAL OR ELECTRIONIC EQUIPMENT
摘要 <p>The invention has an object to provide a foam laminate with excellent repeelability for electric or electronic devices. Also, the invention has an object to provide a foam laminate with excellent repeelability and excellent heat resistance for electric or electronic devices. A foam laminate for electric or electronic devices of the invention has, on at least one side of a foam layer, a pressure-sensitive adhesive layer having a crystal melting energy of 50 J/g or less, obtained according to the following: the crystal melting energy is a melting heat (J/g) obtained during a second heating in differential scanning calorimetry conducted under conditions of heating at a heating rate of 10° C./min to melt (a first heating), followed by cooling down to -50° C. at a cooling rate of 10° C./min (a first cooling), and then heating from -50° C. at a heating rate of 10° C./min (the second heating) (according to JIS K 7122).</p>
申请公布号 KR20140002717(A) 申请公布日期 2014.01.08
申请号 KR20137019538 申请日期 2012.01.16
申请人 NITTO DENKO CORPORATION 发明人 WATANABE NAOMI;HATANAKA ITSUHIRO
分类号 B32B5/18;B32B7/12;C09J7/02 主分类号 B32B5/18
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