| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve heat radiation characteristics of a semiconductor device. <P>SOLUTION: A semiconductor device has: a die pad 3; a frame like heat diffusion plate 6 disposed between the die pad 3 and multiple leads 4 so as to enclose the die pad 3; multiple members 9 connecting the die pad 3 with an inner periphery of the heat diffusion plate 6; and a hanging lead 10 connecting with an outer periphery of the heat diffusion plate 6. A semiconductor chip 2 having a larger shape than that of the die pad 3 is mounted on the die pad 3 and the multiple members 9. An entire upper surface of the die pad 3 and entire upper surfaces of portions of the multiple members 9, which face a rear surface of the semiconductor chip 2, are bonded to the rear surface of the semiconductor chip 2 with a silver paste. Heat of the semiconductor chip 2 is transmitted from the rear surface of the semiconductor chip 2 to the heat diffusion plate 6 going through the silver paste, the die pad 3 and the members 9. Then, the heat is diffused from the heat diffusion plate 6 to the exterior of the semiconductor device going through the leads 4. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
