| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to prevent an electrical short when a bonding wire is contacted with an edge part of an active surface of a semiconductor chip, by using an insulating layer made of a plastic resin such as a polyimide or epoxy. CONSTITUTION: A semiconductor package includes a semiconductor chip(210), a substrate(220), a bonding wire(250), a resin encapsulation part(230), and many external connection terminals. The semiconductor chip includes a silicon substrate, many electrode pads, inert layer, and a polyimide layer. Opposite surface of the active surface of the semiconductor chip is attached on an upper part. The bonding wire connects an electrode pad of the semiconductor chip to the substrate. The resin encapsulation part covers the semiconductor chip and the bonding wire. Many external connection terminals are formed to a lower surface of the substrate, and are electrically connected to the semiconductor chip. The bonding wire contacted with the edge part of the semiconductor chip is contacted with a polyimide layer formed at the edge part of the semiconductor chip, thereby preventing an electrical short generation between the bonding wire and the silicon substrate. |
