发明名称 METHOD OF MANUFACTURING MULTI-LAYER CERAMIC CHIP CAPACITOR
摘要 PURPOSE: A manufacturing method is provided to obtain a multi-layer ceramic chip capacitor(MLCC) with improved thermal impact resistance by laminating with a differential in length at end portion of an electrode layer. CONSTITUTION: In manufacturing a MLCC, terminal electrodes are formed at both ends of the MLCC, dielectric layers and electrode layers are laminated alternately, one end of each electrode layer is connected to the terminal electrode, and the other end is not connected to the terminal electrode. The most adjacent electrode layers connected to the same terminal electrode have a differential in the length from the terminal electrode to the opposite end. So, the electrode layers have variation in the end position to have a portion which is formed with partial electrode layers. So, a step-shaped structure is obtained to alleviate an inclination of chip thickness difference according to the difference of a printed layer.
申请公布号 KR20010009879(A) 申请公布日期 2001.02.05
申请号 KR19990028481 申请日期 1999.07.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SHIN, YU SEON
分类号 H01G4/30 主分类号 H01G4/30
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