发明名称 METHOD FOR MANUFACTURING OPTOELECTRONIC DEVICE, DEVICE FOR PRESSING AND HARDENING SEALING MATERIAL, OPTOELECTRONIC DEVICE AND ELECTRONIC APPLIANCE
摘要 PROBLEM TO BE SOLVED: To provide an optoelectronic device and a method for manufacturing optoelectronic device by which the process of cleaning an optoelectronic material cell is made unnecessary and the production efficiency can be improved. SOLUTION: Substrate mother boards 111A, 112A containing a plurality of substrate forming regions 11a, 12a where substrates 11 and counter substrates 12 are to be formed, respectively, are used, and after an unhardened sealing material 14A is formed into a ring form without having an injection port in the peripheral part of each substrate forming region 12a of the counter substrate mother board 112A, a liquid crystal (optoelectronic material) is applied on the region inside of the unhardened sealing material 14A of each substrate forming region 12a to form a liquid crystal layer (optoelectronic material layer) 13. Then the counter substrate mother board 112A and the substrate mother board 111A are adhered with the unhardened sealing material 14A to form a liquid crystal cell mother board (optoelectronic material cell mother board)113A. The sealing material 14A is hardened to form a sealing material 14 and the liquid crystal cell mother board 113A is cut along the substrate forming regions 11a, 12a.
申请公布号 JP2001312214(A) 申请公布日期 2001.11.09
申请号 JP20000128366 申请日期 2000.04.27
申请人 SEIKO EPSON CORP 发明人 GYODA KOZO
分类号 G02F1/13;G02F1/1333;G02F1/1339;G09F9/00;(IPC1-7):G09F9/00;G02F1/133 主分类号 G02F1/13
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