Polyphenylene sulfide film, method for producing the same, and circuit board using the same

摘要

A polyphenylene sulfide film has a heat distortion temperature of 200° C. or more. The polyphenylene sulfide film of the present invention has superior soldering heat resistance, dimensional stability to heat, low hygroscopicity, fire retardance, and high-frequency properties, and also the polyphenylene sulfide film is suitable for use as an insulating substrate which has superior processability in a circuit board.