| 摘要 |
Discloses is apparatus for manufacturing a semiconductor wafer to fill a semiconductor having a via hole with an insulating layer, a barrier layer, and a conductive layer. The apparatus for manufacturing a semiconductor wafer includes a bubble removal module removing bobbles in the via hole; an insulating layer formation module forming the insulating layer in a wafer via hole where the bubble are removed; a conductive layer formation layer forming the conductive layer in the wafer via hole formed in the barrier layer; and an inter-module transfer device moving the wafer among the conductive layer formation module and the barrier layer formation module, the insulating formation module, and the bubble removal module. |
