发明名称 Method of manufacturing semiconductor memory device
摘要 A semiconductor device includes a semiconductor substrate, a non-volatile semiconductor memory element formed over the semiconductor substrate, including a variable resistance element including a laminate comprising a first electrode, a variable resistance layer, and a second electrode, and a volatile semiconductor memory element formed over the semiconductor substrate, including a capacitance element including a laminate comprising a third electrode, a dielectric layer including a same material as the variable resistance layer, and a fourth electrode.
申请公布号 US8624313(B2) 申请公布日期 2014.01.07
申请号 US201113137701 申请日期 2011.09.06
申请人 KAJIGAYA KAZUHIKO 发明人 KAJIGAYA KAZUHIKO
分类号 H01L27/108;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L27/108
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