SILVER-COATED COPPER POWDER AND METHOD FOR PRODUCING SAME, SILVER-COATED COPPER POWDER-CONTAINING CONDUCTIVE PASTE, CONDUCTIVE ADHESIVE AGENT, CONDUCTIVE FILM, AND ELECTRIC CIRCUIT

摘要

The present invention provides a silver-coated copper powder exhibiting excellent conductivity and migration resistance and a method for producing the same, and a conductive paste, conductive adhesive agent, conductive film and electric circuit containing the silver-coated copper powder. A method for producing a silver-coated copper powder in which a copper powder and a silver fine-particle powder are mixed and stirred and the silver fine-particle powder is adhered to the particle surfaces of the copper powder; wherein a silver-coated copper powder exhibiting excellent conductivity and migration resistance can be obtained by carrying out all the treatment processes as dry processes, and by using, as the silver fine-particle powder, silver fine-particle powder in which the particle surfaces have been surface coated with a dispersing agent.