发明名称 METHOD OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To solve the problem of appearance failure due to burr, breaks, etc., formed when a ceramic board is divided into individual wiring boards. SOLUTION: For cutting off one ceramic board 9 along dividing grooves 4 to form a number of wiring boards 8, first notches like a letter V of 23-28 deg. and second notches like a letter V of 35-40 deg. at the top end angle are formed into the bottoms of the dividing grooves 4, and the first notches are located nearer to an insulation base than the second recesses and made deeper than the second recesses.
申请公布号 JP2002016367(A) 申请公布日期 2002.01.18
申请号 JP20000194394 申请日期 2000.06.28
申请人 KYOCERA CORP 发明人 MATSUDERA HIROSHI
分类号 H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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