| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method in which solder supply can be fixed and thermal load on a component can be reduced. SOLUTION: The soldering method comprises a step for adding a specified quantity of solder 3 to the electrode lead part 2 of an electronic component 1, a step for mounting the electronic component 1 on a printed board 6 and touching the solder 3 to a land 8 provided on the printed board, and a step for fusing the solder 3 by touching it to the flux 18 in a flux bath 16 fluidized at a temperature higher than the melting point of the solder. |
