| 摘要 |
PROBLEM TO BE SOLVED: To provide a small, light weight, and thin semiconductor device where no resin intrudes into a light receiving part of a semiconductor element, causing no degradation in light-receiving characteristics. SOLUTION: There are provided a base body 5 where a semiconductor element 1, in which a light receiving part 2 is provided on an upper surface while an electrode 8 is formed at the peripheral edge of the upper surface, is placed on an upper-side main surface and an electrode pad 9 is formed on the peripheral side away from the placement part for the semiconductor element 1 on the upper-side main surface, a bonding wire 6 electrically connecting the electrode 8 to the electrode pad 9, an ultraviolet ray setting resin 4 so provided across the entire circumference of the perimeter of the upper surface as to cover the electrode 8 and a erected part of the bonding wire 6 from the electrode 8, a transmissive member 3 which is, almost the same shape as the semiconductor element 1 in appearance, so bonded to the upper part of the ultraviolet ray setting resin 4 as to cover the semiconductor element 1, and a sealing resin 7 which seals the entire circumference of side parts of the semiconductor element 1, the ultraviolet ray setting resin 4, and the transmissive member 3.
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