发明名称 |
Method for making a semiconductor device |
摘要 |
A method of making a semiconductor device comprising a semiconductor element and a support member having a recess for housing the semiconductor element is disclosed. The method includes placing at least two lead electrode portions in the molding die; supplying a molding member to the molding die so that the molding member contacts the portion of at least two lead electrode portions; heating the molding member in the molding die so as to cure the molding member into a package with the portion of at least two lead electrode portions; and removing the package from the molding die by a pushing member such that at least one of a protrusion and a recess are formed in a surface of the package. Using this process, a semiconductor device can be obtained with a high process yield. |
申请公布号 |
US8623255(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US20050208609 |
申请日期 |
2005.08.23 |
申请人 |
ASAKAWA HIDEO;NICHIA CORPORATION |
发明人 |
ASAKAWA HIDEO |
分类号 |
H01L21/56;H01L31/0203;H01L33/20;H01L33/48;H01L33/58;H01L33/62 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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